In electronics, failures hide at small scale: a cracked solder joint, an ionic contamination film, a delaminated package. MatX Lab localizes defects, confirms cleanliness, and verifies materials across boards, components, and packages.
At a small scale, electronics malfunctions can manifest as mishaps such as unsecured connections in soldering tubes, ionic contamination films and packaging, and the presence of metal tin foil between pads. The characterization of electronic materials and assemblies by MatX Lab enables the identification of defects, the cleanliness of the material, its compatibility with specifications, and the explanation of why a board failed reliability testing. Work is carried out on boards, packages, and components as well as on contamination and thermal stresses
Electronics projects concentrate on addressing issues of failure localization, cleanliness, and reliability.
Typically, electronic failure work involves a combination of imaging and surface or elemental methods before any non-destructive inspection. We examine the sequence and report it as a single examination.
| Method | What It Answers | Typical Samples |
|---|---|---|
| Failure Analysis | Defect localization and root cause | Failed boards, components, packages |
| Imaging & Microscopy | Solder, intermetallics, cracks, delamination | Cross-sections, joints, dies |
| Surface Analysis | Contamination, oxidation, plating chemistry | Pads, leads, coatings |
| 3D Characterization | Internal defects and voids, non-destructive | Packages, solder joints, BGAs |
| Elemental Analysis | Composition, contamination, restricted-substance elements | Solders, platings, residues |
| Particle Analysis | Residue and particulate identification | Boards, cleanroom samples |
Electronics assemblies combine solders, platings, laminates, encapsulants, and semiconductor materials, each with a distinct failure signature.
Thin Films & Coatings · Wafers & Die · Metals & Alloys · Plastics · Adhesives & Sealants · Powders & Bulk Solids
The testing of electronics equipment is conducted using industry method manuals and international standards, which are typically identified by your customer. Your report cites the applicable standard for testing, where it is relevant. We conform to the designation your program demands and record it.
| Analysis / Standard | What It Covers |
|---|---|
| Ebic | Electron Beam Induced Current |
| Tlp | Transmission Line Pulse |
| Dhem | Differential Hall Effect Metrology |
| TDR | Time Domain Reflectometry |
| ROSE Test | Ionic Contamination Testing of PCBs |
| EDS/EDX | Energy Dispersive X-Ray Spectroscopy |
| HDT | Heat Deflection Temperature |
| ASTM C201 | High-Temperature Thermal Conductivity Testing () |
| ASTM C177 | Thermal Conductivity Test |
| IEC 62321 | RoHS Compliance Screening by XRF & GC-MS |
| IEC 60243 | Electrical Breakdown Strength Testing of Insulating Materials |
| UL 263 | Test Services Fire and Flammability Testing |
| UL 10C | Positive Pressure Fire Tests of Door Assemblies |
| ASTM E475 | Method for Assay of Di-Tert-Butyl Peroxide using Gas Chromatography |
| ASTM D7309 | Flammability Characteristics of Plastics and Other Solid Materials using |
MatX Lab's network of accredited partner laboratories facilitates your electronics testing, resulting in one-stop solutions for imaging, surface, and elemental work. One contact, one report. The methods are matched to IPC, IEC, JEDEC and ASTM where a published method is applicable. We conduct evaluations and report outcomes, but we are not a standards organization and do not grant certifications. Any discussion can be conducted under an NDA.
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