MatX Lab traces contamination, measures films, and localizes defects on wafers, die, and packages. In semiconductor material testing, the defect that matters is a few atoms of the wrong element or a film nanometers too thick.
In semiconductor manufacturing, even the smallest material changes can have a major impact: a few unwanted atoms, a thin film that is slightly too thick, or a hidden defect at an interface can affect yield and long-term reliability. MatX Lab analyzes wafers, dies, thin films, and packages to help identify contamination sources, measure film properties, locate defects, and understand why a device failed. The analysis works at the same tiny scale where semiconductor issues occur, down to the atomic level.
Semiconductor projects focus on identifying contamination, understanding thin-film properties, and investigating defects and failures. The main questions are what the contaminant is and where it came from, whether a film has the correct thickness and composition, and what caused a device or wafer to fail at the materials level.
Semiconductor analysis often requires a combination of high-resolution imaging, surface analysis, and elemental testing to understand what is happening at the material level. We usually begin with non-destructive inspection methods wherever possible, then select additional techniques based on what the investigation reveals. We define the testing approach and present the findings as one complete investigation.
| Method | What It Answers | Typical Samples |
|---|---|---|
| Surface Analysis | Trace contamination, thin-film chemistry, depth profiles | Wafers, films, die |
| Imaging & Microscopy | Defects, cross-sections, interfaces at nanoscale | Die, wafers, packages |
| Elemental Analysis | Trace metals and composition | Wafers, films, residues |
| 3D Characterization | Internal defects and voids, non-destructive | Packages, interconnects |
| Failure Analysis | Defect localization and root cause | Failed die and packages |
| Particle Analysis | Particle identification and cleanliness | Wafers, cleanroom samples |
Semiconductor work centers on wafers, die, and the thin films and coatings built on them.
Wafers & Die · Thin Films & Coatings · Nanomaterials · Metals & Alloys · Ceramics & Glass
Semiconductor testing draws on SEMI and ASTM methods for silicon and electronic materials, and your process usually names them. Where an applicable standard exists, testing is aligned to it and cited in your report. We align to the method your process requires and document it.
| Analysis / Standard | What It Covers |
|---|---|
| RGA | Residual Gas Analysis |
| Micro-Raman Spectroscopy | FTIR & Raman Spectroscopy |
| Micro-FTIR | Micro-Fourier Transform Infrared Spectroscopy |
| ToF-SIMS | Time-Of-Flight Secondary Ion Mass Spectrometry |
| AES | Auger Electron Spectroscopy |
| SIMS | Secondary Ion Mass Spectrometry |
| Gravimetric Nvr | Trace, Residue & Contamination Analysis |
| ASTM E996 | XPS & Auger Electron Spectroscopy Data Reporting & Analysis |
| ASTM E995 | Background Subtraction in Auger & XPS Spectra |
| ASTM E2911 | Relative Intensity Correction of Raman Spectrometers |
| ASTM E2529 | Raman Spectrometer Spectral Resolution Testing |
| ASTM E1840 | Raman Shift Frequency Calibration of Raman Spectrometers |
| ASTM D6071 | Low-Level Sodium in High Purity Water by Graphite Furnace |
| ASTM E984 | Chemical & Matrix Effect Identification in Auger Electron Spectroscopy |
| ASTM D6130 | Silicon by Inductively Coupled Plasma - Atomic Emission Spectroscopy |
Yes. Surface and elemental analysis identify trace metal, organic, and particle contamination and often point to its source, at the concentrations semiconductor processes care about. This is one of our most common semiconductor requests.
Yes. Surface analysis and cross-sectional imaging help us understand how thin films are built, including their thickness, composition, and the quality of the interfaces between layers. These methods can also provide depth profiles across a material stack to identify changes or variations through different layers. The results are measured and reported against the targets and requirements you define.
Can you localize a defect in a die or package without destroying it? Yes. We sequence non-destructive methods first, including X-ray and 3D CT, to locate a defect before any cross-section or de-processing. If the unit is unique, tell us, and we get approval before any destructive step.
MatX Lab brings together semiconductor testing through a network of accredited partner laboratories, making it easier to manage surface, imaging, and elemental analysis as one connected investigation. Instead of coordinating multiple providers, you have one contact managing the work and one report bringing all the results together. Testing follows SEMI and ASTM methods where relevant published procedures are available. We focus on analyzing materials and providing reliable data; we are not a standards organization, we do not certify products, and we do not issue certifications. Projects can also be carried out under an NDA to protect your information.
Test Your Materials