A bond fails at the weakest point you did not check: a contaminated surface, an under cured joint, the wrong adhesive. MatX Lab identifies the product, measures bond strength, and finds why a joint let go.
A bond usually fails because of something that was missed: a contaminated surface, incomplete curing, or an adhesive that was not suitable for the application.MatX Lab helps analyze adhesives and sealants to identify materials, confirm cure conditions, measure bond performance, and understand the reasons behind joint failures. Our analysis looks at the adhesive, the surfaces it bonds with, and the fracture area to determine whether the failure occurred within the adhesive, the substrate, or at the interface between the two.
Adhesive analysis focuses on understanding the material, its cure condition, and how well the bond performs. We identify the adhesive chemistry, assess the level of cure, measure bond strength, and investigate the reasons behind joint failures. The same analytical methods used to verify incoming adhesives can also support deformulation studies and detailed failure investigations.
Adhesive work usually combines an identity method with mechanical bond testing and surface analysis, and we scope the combination your question needs. The methods below are the ones we reach for most, and each links to its own page.
Enables deformulation and uses FTIR to identify the adhesive chemistry and additives. It is the quickest method for flagging a substitute or verifying a product.
Measures lap shear, peel, and tensile bond strength. These numbers determine whether a joint meets its specification and how it fails under load.
Uses DSC and TGA to measure the cure state, glass transition, and thermal stability. Weak bonding is frequently caused by undercure, which is frequently undetectable.
Characterizes bond-surface chemistry and contamination by XPS. Adhesion problems frequently trace back to what was on the surface before bonding.
Examines fracture surfaces to distinguish adhesive from cohesive failure and to reveal voids, contamination, or incomplete wetting.
Identifies fillers and inorganic contaminants that affect performance or point to a formulation change.
Determines whether a bond failed from surface contamination, undercure, the wrong adhesive, or overload, and reports the root cause with supporting evidence.
Adhesive testing is needed in many industries where materials are joined, sealed, or used to protect components. When a bond fails, it can cause problems ranging from leaks and unwanted noise to serious structural issues.
Aerospace · Automotive · Electronics · Manufacturing · Medical Devices
Adhesive testing is method-driven, and your specification usually names the standard. Where an applicable standard exists, testing is aligned to it and cited in your report. We align to the method your specification requires and document it.
| Analysis / Standard | What It Covers |
|---|---|
| Orange Peel Failure Analysis | Root Cause & Defect Investigation |
| Lap Shear Tests | Shear, Peel & Tear |
| ASTM D1004 | Tear Resistance |
| ASTM E604 | Tear Testing of Metallic Materials |
| ASTM D903 | Peel or Stripping Strength of Adhesive Bonds |
| ASTM E736 | Cohesion/Adhesion of Fire-Resistive Materials |
| ASTM E251 | Performance Characteristics of Metallic Bonded Resistance Strain Gauges |
| ASTM D950 | Impact Strength of Adhesive Bonds |
| ASTM D7842 | Holding Strength of Tack and Prong Fastener Attached Buttons |
| ASTM D7105 | Adhesive and Cohesive Strength |
| ASTM D6736 | Burnish Resistance of Latex Paints |
| ASTM D6580 | Zinc in Zinc Dust and in Cured Films |
| ASTM D6204 | Unvulcanized Rheological Properties of Rubber using Rotorless Shear Rheometers |
| ASTM D3632 | Accelerated Aging of Adhesive Joints by Oxygen-Pressure Test |
| ASTM D2739 | Volume Resistivity of Conductive Adhesive |
Yes. FTIR and thermal analysis identify the adhesive chemistry and much of its formulation, including fillers. This supports matching a product, replacing a discontinued adhesive, or verifying an incoming lot
Yes. Bond strength can be measured using methods such as lap shear, peel, tensile, and pull-off testing, depending on the type of joint and materials involved. We select the most suitable test for your application and compare the results against your required acceptance criteria.
Yes. Fracture-surface imaging helps determine whether the failure occurred within the adhesive or between the bonded surfaces. Surface and thermal analysis then identify whether contamination, incomplete curing, or an unsuitable adhesive caused the issue. We report the findings back to the root cause. For the most accurate results, send the failed joint in its original, unchanged condition.
MatX Lab works with a network of accredited partner laboratories, giving you access to the right testing capabilities for adhesive and sealant analysis through one coordinated program. You have one point of contact and receive one complete report covering the results. Where recognized methods are available, testing is aligned with relevant ASTM, ISO, IEC, UL, and MIL-STD standards.MatX Lab provides analytical testing services and is not a standards organization or certification body. We do not issue certifications. Confidentiality is built into our process, and NDAs are available as standard.
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